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  4. Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System

Publication:
Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System

Date

10-07-2025

Authors

Bhatti, Gulafsha
Sharma, Rohit
Kumar, Mekala Girish
Palaparthy, VinayORCID 0000-0002-8867-5285
Agrawal, YashORCID 0000-0001-9736-9581

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IEEE

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Gulafsha Bhatti, Yash Agrawal, Vinay Palaparthy, Rohit Sharma, and Mekala Girish Kumar, "Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System," IEEE Transactions on Components, Packaging and Manufacturing Technology, IEEE, ISSN: 2156-3985, 10 Jul. 2025, doi: 10.1109/TCPMT.2025.3587385.

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https://ir.daiict.ac.in/handle/dau.ir/2163

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