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Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System

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dc.contributor.affiliationDA-IICT, Gandhinagar
dc.contributor.authorBhatti, Gulafsha
dc.contributor.authorSharma, Rohit
dc.contributor.authorKumar, Mekala Girish
dc.contributor.authorPalaparthy, Vinay
dc.contributor.authorAgrawal, Yash
dc.date.accessioned2025-09-16T10:33:21Z
dc.date.issued10-07-2025
dc.identifier.citationGulafsha Bhatti, Yash Agrawal, Vinay Palaparthy, Rohit Sharma, and Mekala Girish Kumar, "Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System," IEEE Transactions on Components, Packaging and Manufacturing Technology, IEEE, ISSN: 2156-3985, 10 Jul. 2025, doi: 10.1109/TCPMT.2025.3587385.
dc.identifier.doi10.1109/TCPMT.2025.3587385
dc.identifier.issn2156-3985
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2163
dc.language.isoen
dc.publisherIEEE
dc.sourceIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.urihttps://ieeexplore.ieee.org/document/11075702
dc.titleReliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System
dspace.entity.typePublication
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relation.isAuthorOfPublication.latestForDiscoverydbe8164f-7d10-44b4-9b2a-88bf75fb926e

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