Person: Agrawal, Yash
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Yash Agrawal
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Publication Metadata only Carbon Nanotube Interconnects - A Promising Solution for VLSI Circuits(Taylor & Francis, 26-04-2016) Kumar, Mekala Girish; Agrawal, Yash; Chandel, Rajeevan; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only A Novel Slice-Based High-Performance ALU Design Using Prospective Single Electron Transistor(Taylor & Francis, 01-03-2022) Patel, Rashmit; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Agrawal, Yash; Parekh, Rutu; Agrawal, Yash; Parekh, RutuPublication Metadata only Signal Integrity Assessment of GNRFET-based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion(IOP Publishing, 22-03-2023) Mekala, Girish Kumar; Malothu, Rajeswari; Agrawal, Yash; Chandel, R; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Temperature compensated and soil density calibrated soil moisture profiling sensor with multi-sensing point for in-situ agriculture application(Elsevier, 30-09-2022) Patle, Kamlesh S; Panchal, Vishvesh; RiyaSaini,; Palaparthy, Vinay S; Agrawal, Yash; Palaparthy, Vinay; Agrawal, Yash; Palaparthy, Vinay; Palaparthy, Vinay S; Saini, Riya (202100101); Panchal, Vishvesh (201601255); Patle, Kamlesh S (202121017)Publication Metadata only Highly Sensitive Hierarchical MoS2 Nanoflowers for In-Situ Soil Moisture Sensing(Elsevier, 01-12-2022) Kumar, Naveena; Borkar, Hitesh; Siroha, Piyush; Kumar, Rajesh; Patle, Kamlesh S; Dey, Kajal Kumar; Sing, Davender; Sharma, Yashpal; Ramovatar,; Palaparthy, Vinay S; Gangwar, Jitendra; Agrawal, Yash; Palaparthy, Vinay; Agrawal, Yash; Palaparthy, Vinay; Palaparthy, Vinay S; Patle, Kamlesh S (202121017)Publication Metadata only Fractional Derivative Based TVD Smoothening and Baseline Correction for Extracting Leaf Wetness Duration From LW Sensor: A Novel Approach(IEEE, 28-11-2023) Gupta, Samaksh; Kumar, Ahlad; Palaparthy, Vinay S; Agrawal, Yash; Agrawal, Yash; Palaparthy, Vinay; Palaparthy, Vinay; Palaparthy, Vinay; Roy, Anil; Roy, Anil; Roy, Anil; Palaparthy, Vinay SPublication Metadata only An Efficient Crosstalk Model For Coupled Multiwalled Carbon Nanotube Interconnects(IEEE, 01-04-2018) Kumar, Mekala Girish; Chandel, Rajeevan; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only A Novel Unified Model for Copper and MLGNR Interconnects using Voltage and Current-Mode Signaling Schemes(IEEE, 01-02-2017) Agrawal, Yash; Kumar, Girish; Kumar, Mekala; Chandel, Rajeevan; DA-IICT, GandhinagarPublication Metadata only Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit(Taylor & Francis, 26-02-2023) Bhatti, Gulafsha; Pathade, Takshashila; Agrawal, Yash; Palaparthy, Vinay; Gohel, Bakul; Parekh, Rutu; Kumar, Mekala Girish; Palaparthy, Vinay S; Gohel, Bakul; Parekh, Rutu; Gulafsha Bhatti (202021005); Takshashila Pathade (201621013)Publication Metadata only Crosstalk Analysis of Current-Mode Signalling-Coupled RLC Interconnects Using FDTD Technique(Taylor & Francis, 01-03-2016) Agrawal, Yash; Chandel, Rajeevan; DA-IICT, Gandhinagar
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