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  4. Signal Integrity Assessment of GNRFET-based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion

Publication:
Signal Integrity Assessment of GNRFET-based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion

Date

22-03-2023

Authors

Mekala, Girish Kumar
Malothu, Rajeswari
Agrawal, YashORCID 0000-0001-9736-9581
Chandel, R

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IOP Publishing

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Abstract

Signal integrity assessment was carried out for graphene nanoribbon field-effect transistor (GNRFET)-based ternary logic with dielectric inserted multi-layered GNR (MLGNR) interconnects. The analyses were carried out for crosstalk effects and eye diagrams with and without shielding lines. First, it was observed that the dielectric inserted MLGNR interconnects show better than copper (Cu) and multiwall carbon nanotube (MWCNT) interconnects. Then, an active shield technique was adopted, and it was observed that the transistor exhibits better performance than without shield and passive shield techniques. Also, the power-delay product performance parameter was evaluated and showed that the active shield technique outperforms passive technique. Further, the eye diagram analysis was carried out for different bit rates. The different performance analyses were carried out for 10 nm technology node.

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Girish Kumar Mekala, Rajeswari Malothu, Agrawal, Yash, and R. Chandel, "Signal Integrity Assessment of GNRFET-based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion," ECS Journal of Solid State Science and Technology, IOP Publishing, ISSN: 2162-8777, 22 Mar. 2023, doi: 10.10.1149/2162-8777/acc68b.

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https://ir.daiict.ac.in/handle/dau.ir/2026

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