Publication: Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit
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Taylor & Francis
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Gulafsha Bhatti, Takshashila Pathade, Agrawal, Yash,Palaparthy, Vinay S, Gohel, Bakul, Parekh, Rutu, and Mekala Girish Kumar, "Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit," IETE Journal of Research, Taylor & Francis, ISSN: 0974-780X, 26 Feb. 2023, pp. 1-16, doi: 10.1080/03772063.2023.2177201.