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Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit

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dc.contributor.affiliationAgrawal, Yash
dc.contributor.affiliationPalaparthy, Vinay S
dc.contributor.affiliationGohel, Bakul
dc.contributor.affiliationParekh, Rutu
dc.contributor.authorBhatti, Gulafsha
dc.contributor.authorPathade, Takshashila
dc.contributor.authorAgrawal, Yash
dc.contributor.authorPalaparthy, Vinay S
dc.contributor.authorGohel, Bakul
dc.contributor.authorParekh, Rutu
dc.contributor.authorKumar, Mekala Girish
dc.contributor.authorAgrawal, Yash
dc.contributor.authorGohel, Bakul
dc.contributor.authorAgrawal, Yash
dc.contributor.authorGohel, Bakul
dc.contributor.authorAgrawal, Yash
dc.contributor.authorAgrawal, Yash
dc.contributor.authorGohel, Bakul
dc.contributor.authorGohel, Bakul
dc.contributor.researcherGulafsha Bhatti (202021005)
dc.contributor.researcherTakshashila Pathade (201621013) 
dc.date.accessioned2025-08-01T13:09:34Z
dc.date.issued26-02-2023
dc.format.extent2878-2893
dc.identifier.citationGulafsha Bhatti, Takshashila Pathade, Agrawal, Yash,Palaparthy, Vinay S, Gohel, Bakul, Parekh, Rutu, and Mekala Girish Kumar, "Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit," IETE Journal of Research, Taylor & Francis, ISSN: 0974-780X, 26 Feb. 2023, pp. 1-16, doi: 10.1080/03772063.2023.2177201.
dc.identifier.doihttps://doi.org/10.1080/03772063.2023.2177201
dc.identifier.issn0974-780X
dc.identifier.scopus2-s2.0-85149272898
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2041
dc.identifier.wosWOS:000940422700001
dc.publisherTaylor & Francis
dc.relation.ispartofseriesVol. 70; No. 3
dc.source IETE Journal of Research
dc.source.urihttps://www.tandfonline.com/doi/abs/10.1080/03772063.2023.2177201
dc.titleNeural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit
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