Publications
Permanent URI for this collectionhttps://ir.daiict.ac.in/handle/123456789/32
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Publication Metadata only Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System(IEEE, 10-07-2025) Bhatti, Gulafsha; Sharma, Rohit; Kumar, Mekala Girish; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only In-House Developed Graphene-Based Leaf Wetness Sensor With Enhanced Stability(IEEE, 01-06-2025) Patle, Kamlesh; Yogi, Pooja; Maru, Devkaran; Palaparthy, Vinay; Moez, Kambiz; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs(IEEE, 04-03-2025) Kumar, Mekala Girish; Agrawal, Yash; Pulluri, Harish; Sharma, Rohit; DA-IICT, GandhinagarPublication Metadata only Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application(IEEE, 01-07-2025) Bhatti, Gulafsha; Maru, Devkaran; Patle, Kamlesh; Shah, Kinnaree; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System(IEEE, 24-07-2025) Bhatti, Gulafsha; Kumar, Mekala Girish; Sharma, Rohit; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarA printed circuit board (PCB) is one of the strong backbones to execute electronic system designs. Due to fast and reliable communication requirements between integrated circuit and other peripheral components over the PCB, there is a quest for the development of board-level designs and layouts. The advancement in technology has led to inventions from conventional rigid to flexible PCBs or flexible electronics (FE). The conformability of FE circuitry majorly depends upon the stretchable interconnects. An interconnect is the medium through which a signal is transmitted. The characteristic of stretchable interconnects is determined through their electrical and mechanical properties. The analytical model and parasitic extraction of the interconnect for rigid PCB structures have been widely explored earlier. However, the analytical formulation of the stretchable interconnect still remains a challenge and meagerly explored till date. Consequently, in this work, an explicit analytical model for the parasitic extraction of stretchable interconnects, viz., resistance (R), inductance (L), and capacitance (C), under stretching and bending effects has been novelly proposed. Five different interconnect materials have been considered for the analysis. The analytical model results have been validated with the ANSYS EDA tool. It is investigated that the proposed analytical model results are in very close agreement with the ANSYS results for all the considered cases.Publication Metadata only Experimental Investigation of Leaf Wetness Sensing Properties of MoS2 Nanoflowers-Based Flexible Leaf Wetness Sensor(IEEE, 01-02-2023) Khaparde, Priyanka; Patle, Kamlesh S; Agrawal, Yash; Borkar, Hitesh; Palaparthy, Vinay; Gangwar, Jitendra; Roy, Anil; Agrawal, Yash; Palaparthy, Vinay; Roy, Anil; Patle, Kamlesh S (202121017)To abate crop loss, it is important to explore the plant disease management systems, where leaf wetness sensors (LWS) are widely used. The leaf wetness duration (LWD) extracted from the LWS is related to plant diseases. In this work, we have fabricated the LWS on the polyamide flexible substrate where Molybdenum disulfide (MoS2) is used as the sensing film to explore the leaf wetness sensing mechanism. Further, we have passivated the MoS2�with the help of acrylic protective lacquer (APL) conformal coating (MoS2�+ APL), which reduce the interaction of the water molecules with the sensor. Lab measurements indicated that fabricated LWS on the flexible substrate with MoS2�and MoS2�+ APL as the sensing film offers a response of about ? 40 000% and ? 250%, respectively, at 500 Hz excitation frequency when the entire sensing area is filled with the water molecule. The response time of the MoS2�and APL-coated flexible sensor is about 180 s. Fabricated LWS sensors offer hysteresis of about � 4% in wetness. Further, we have identified that oxidation of the sulphur in the MoS2�plays an important role in the leaf wetness sensing mechanism. Furthermore, we understood that MoS2�when passivated with APL coating, the oxidation effect is reduced and the sensor response is negligible.Publication Metadata only Impact of Electrode Patterns Variation on the Response Characteristic of Leaf Wetness Sensors(IEEE, 05-08-2024) Patle, Kamlesh S; Sharma, Neha; Khaparde, Priyanka; Varshney, Harsh; Bhatti, Gulafsha; Agrawal, Yash; Palaparthy, Vinay; DA-IICT, Gandhinagar; Patle, Kamlesh S(202121017); Sharma, Neha (202211051); Varshney, Harsh (202211001); Bhatti, Gulafsha (202021005)Prediction of plant diseases is essential to reduce crop loss. Early disease prediction models have been investigated for this purpose, where data on leaf wetness duration (LWD) is one of the key components. Leaf wetness sensors (LWSs) are used to better understand how foliar wetness affects plant disease cycles and epidemic development. LWS can be fabricated on printed circuit boards (PCBs), where interdigitated electrode patterns are widely used. However, it is important to understand the efficacy of these patterns for in-situ measurements. For this purpose, in this work, we have fabricated three different patterns viz. circular, oval, and rectangular on the PCB and tested their efficacy during lab and field measurements. Lab measurements indicate that the circular patterned LWS offers a sensitivity of about 1600% over the dry-to-wet range, which is about 2 and 1.5 times more than oval and rectangular patterns, respectively. Besides this, circular patterned LWS offers the hysteresis of about 2%, whereas the oval and rectangular patterned LWS show about 3% and 7%, respectively. Field measurement results specify that circular patterned LWS and commercial LWS Phytos 31 indicate the same number of LWD events. However, oval and rectangular patterned LWS shows extra false events.Publication Metadata only Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit(Taylor & Francis, 26-02-2023) Bhatti, Gulafsha; Pathade, Takshashila; Agrawal, Yash; Palaparthy, Vinay; Gohel, Bakul; Parekh, Rutu; Kumar, Mekala Girish; DA-IICT, Gandhinagar; Gulafsha Bhatti (202021005); Takshashila Pathade (201621013)At nanometer technology nodes, the efficient signal integrity and performance assessment of vast on-chip interconnects are crucial and challenging. For a long time, copper (Cu) has been used as an interconnect material in integrated circuits (ICs). However, as heading towards lower technology nodes, Cu is becoming inadequate to satisfy the requirements for high-speed applications due to its physical limitations. To mitigate this issue, a multiwall carbon nanotube bundle (MWCNTB) is proven to be a better replacement for Cu. Hence, the current work innovatively focuses on modeling, analysis, and performance evaluation of MWCNTB interconnects at 32?nm technology nodes using various machine learning (ML) and neural network (NN) based techniques for signal integrity assessment and fast computation of on-chip interconnect design. Based on the results obtained by comparing the different performance parameters, it is envisaged that NN-based ADAM technique leads to the best-suited model. The developed model is fruitful in evaluating the output performance of the system, such as power-delay-product (PDP), performing parametric analysis, and predicting optimum input design parameters of the driver-interconnect-load (DIL) system. This work utilizes HSPICE and Python electronic design automation tools for its implementation.Publication Metadata only Fractional Derivative Based TVD Smoothening and Baseline Correction for Extracting Leaf Wetness Duration From LW Sensor: A Novel Approach(IEEE, 28-11-2023) Agrawal, Yash; Gupta, Samaksh; Roy, Anil; Palaparthy, Vinay; Kumar, AhladOne of the driving factors leading to the modernization in the agriculture sector is the era of sensors-driven technologies. Annually, as reported by the Associated Chambers of Commerce and Industry of India, $500 billion of crops are lost due to pests and plant diseases in a country like India, where at least 200 million Indians go to bed hungry every night. For the detection of plant disease, the measurement of leaf wetness duration (LWD) values becomes a crucial step. This requirement of measuring LWD values led to the development of an in situ IoT-enabled LW sensor earlier. The same LW sensor was deployed for about four months, and data for the same were collected. Furthermore, for extracting LWD information, smoothing algorithms like total variation denoising (TVD) are applied. However, our novelty lies in introducing the order of fractional derivative (?) in an already existing TVD algorithm, which is varied from 1 to 2, and results are found to be satisfying. To get an effective baseline, we combined this algorithm with three baseline correction techniques: asymmetric least squares, improved asymmetric least squares, and asymmetrically reweighted penalized least squares (arPLS). The optimal range of ? lies in the range of 1.6 to 2 for getting the highest accuracy. This study demonstrates that our novel approach of integrating fractional derivatives into an existing TVD algorithm enhances its performance in identifying Leaf wetness events. The highest accuracy (i.e., the highest number of events detected) of 0.80 is found by total variation smoothing with the arPLS baseline correction technique.Publication Metadata only Signal Integrity Assessment of GNRFET-based Ternary Logic for Multi Layered GNR Interconnects with Dielectric Insertion(IOP Publishing, 22-03-2023) Mekala, Girish Kumar; Malothu, Rajeswari; Agrawal, Yash; Chandel, R; DA-IICT, GandhinagarSignal integrity assessment was carried out for graphene nanoribbon field-effect transistor (GNRFET)-based ternary logic with dielectric inserted multi-layered GNR (MLGNR) interconnects. The analyses were carried out for crosstalk effects and eye diagrams with and without shielding lines. First, it was observed that the dielectric inserted MLGNR interconnects show better than copper (Cu) and multiwall carbon nanotube (MWCNT) interconnects. Then, an active shield technique was adopted, and it was observed that the transistor exhibits better performance than without shield and passive shield techniques. Also, the power-delay product performance parameter was evaluated and showed that the active shield technique outperforms passive technique. Further, the eye diagram analysis was carried out for different bit rates. The different performance analyses were carried out for 10 nm technology node.