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  4. Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application

Publication:
Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application

Date

01-07-2025

Authors

Bhatti, Gulafsha
Maru, Devkaran
Patle, Kamlesh
Shah, Kinnaree
Palaparthy, VinayORCID 0000-0002-8867-5285
Agrawal, YashORCID 0000-0001-9736-9581

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IEEE

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Gulafsha Bhatti, Devkaran Maru, Kamlesh Patle, Kinnaree Shah, Vinay Palaparthy, and Yash Agrawal, "Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application," IEEE Sensors Letters, IEEE, ISSN: 2475-1472, vol. 09, no.07, Jul. 2025, Art no. 5502104, pp. 1-4, doi: 10.1109/LSENS.2025.3573885.

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https://ir.daiict.ac.in/handle/dau.ir/2158

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