Publications
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Publication Metadata only Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System(IEEE, 10-07-2025) Bhatti, Gulafsha; Sharma, Rohit; Kumar, Mekala Girish; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only In-House Developed Graphene-Based Leaf Wetness Sensor With Enhanced Stability(IEEE, 01-06-2025) Patle, Kamlesh; Yogi, Pooja; Maru, Devkaran; Palaparthy, Vinay; Moez, Kambiz; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs(IEEE, 04-03-2025) Kumar, Mekala Girish; Agrawal, Yash; Pulluri, Harish; Sharma, Rohit; DA-IICT, GandhinagarPublication Metadata only Signal Integrity Analysis of Biodegradable Stretchable Interconnect for Wearable Application(IEEE, 01-07-2025) Bhatti, Gulafsha; Maru, Devkaran; Patle, Kamlesh; Shah, Kinnaree; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System(IEEE, 24-07-2025) Bhatti, Gulafsha; Kumar, Mekala Girish; Sharma, Rohit; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarA printed circuit board (PCB) is one of the strong backbones to execute electronic system designs. Due to fast and reliable communication requirements between integrated circuit and other peripheral components over the PCB, there is a quest for the development of board-level designs and layouts. The advancement in technology has led to inventions from conventional rigid to flexible PCBs or flexible electronics (FE). The conformability of FE circuitry majorly depends upon the stretchable interconnects. An interconnect is the medium through which a signal is transmitted. The characteristic of stretchable interconnects is determined through their electrical and mechanical properties. The analytical model and parasitic extraction of the interconnect for rigid PCB structures have been widely explored earlier. However, the analytical formulation of the stretchable interconnect still remains a challenge and meagerly explored till date. Consequently, in this work, an explicit analytical model for the parasitic extraction of stretchable interconnects, viz., resistance (R), inductance (L), and capacitance (C), under stretching and bending effects has been novelly proposed. Five different interconnect materials have been considered for the analysis. The analytical model results have been validated with the ANSYS EDA tool. It is investigated that the proposed analytical model results are in very close agreement with the ANSYS results for all the considered cases.Publication Metadata only Experimental Investigation of Leaf Wetness Sensing Properties of MoS2 Nanoflowers-Based Flexible Leaf Wetness Sensor(IEEE, 01-02-2023) Khaparde, Priyanka; Patle, Kamlesh S; Agrawal, Yash; Borkar, Hitesh; Palaparthy, Vinay; Gangwar, Jitendra; Roy, Anil; Agrawal, Yash; Palaparthy, Vinay; Roy, Anil; Patle, Kamlesh S (202121017)To abate crop loss, it is important to explore the plant disease management systems, where leaf wetness sensors (LWS) are widely used. The leaf wetness duration (LWD) extracted from the LWS is related to plant diseases. In this work, we have fabricated the LWS on the polyamide flexible substrate where Molybdenum disulfide (MoS2) is used as the sensing film to explore the leaf wetness sensing mechanism. Further, we have passivated the MoS2�with the help of acrylic protective lacquer (APL) conformal coating (MoS2�+ APL), which reduce the interaction of the water molecules with the sensor. Lab measurements indicated that fabricated LWS on the flexible substrate with MoS2�and MoS2�+ APL as the sensing film offers a response of about ? 40 000% and ? 250%, respectively, at 500 Hz excitation frequency when the entire sensing area is filled with the water molecule. The response time of the MoS2�and APL-coated flexible sensor is about 180 s. Fabricated LWS sensors offer hysteresis of about � 4% in wetness. Further, we have identified that oxidation of the sulphur in the MoS2�plays an important role in the leaf wetness sensing mechanism. Furthermore, we understood that MoS2�when passivated with APL coating, the oxidation effect is reduced and the sensor response is negligible.Publication Metadata only Impact of Electrode Patterns Variation on the Response Characteristic of Leaf Wetness Sensors(IEEE, 05-08-2024) Patle, Kamlesh S; Sharma, Neha; Khaparde, Priyanka; Varshney, Harsh; Bhatti, Gulafsha; Agrawal, Yash; Palaparthy, Vinay; DA-IICT, Gandhinagar; Patle, Kamlesh S(202121017); Sharma, Neha (202211051); Varshney, Harsh (202211001); Bhatti, Gulafsha (202021005)Prediction of plant diseases is essential to reduce crop loss. Early disease prediction models have been investigated for this purpose, where data on leaf wetness duration (LWD) is one of the key components. Leaf wetness sensors (LWSs) are used to better understand how foliar wetness affects plant disease cycles and epidemic development. LWS can be fabricated on printed circuit boards (PCBs), where interdigitated electrode patterns are widely used. However, it is important to understand the efficacy of these patterns for in-situ measurements. For this purpose, in this work, we have fabricated three different patterns viz. circular, oval, and rectangular on the PCB and tested their efficacy during lab and field measurements. Lab measurements indicate that the circular patterned LWS offers a sensitivity of about 1600% over the dry-to-wet range, which is about 2 and 1.5 times more than oval and rectangular patterns, respectively. Besides this, circular patterned LWS offers the hysteresis of about 2%, whereas the oval and rectangular patterned LWS show about 3% and 7%, respectively. Field measurement results specify that circular patterned LWS and commercial LWS Phytos 31 indicate the same number of LWD events. However, oval and rectangular patterned LWS shows extra false events.Publication Metadata only Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects(Elsevier, 16-02-2021) Pathade, Takshashila; Parekh, Rutu; Parekh, Rutu; Agrawal, Yash; Palaparthy, Vinay; Agrawal, Yash; Palaparthy, Vinay; DA-IICT, Gandhinagar; Pathade, Takshashila (201621013)Rigorous technology scaling of integrated circuits to�nanometer range�aids to acquire prodigious operational speed and versatile functionality in system-on-chip. However, this leads to escalation in interconnect parasitics and non-ideal issues that have become primary bottleneck in the existing copper based on-chip interconnect system. Graphene based�carbon nanotube�bundle has emerged as prospective interconnect for high speed applications. This paper focuses on bundled carbon nanotubes and their different spatial arrangements viz. single wall CNTs (SWCNTs), multiwall CNTs (MWCNTs) and mixed CNT bundles (MCBs). Such�bundle configurations�boost the performance of system in terms of reducing system latency and�power consumption�in addition providing system reliability. The significant novel contribution of this paper lies in executing eye-diagram analysis of the futuristic bundled CNT structures as interconnects. Eye-diagram is an important tool for analysing signal integrity effects. The several performance analyses have been performed in SPICE and ADS EDA tools at 22?nm technology node.Publication Metadata only Highly Sensitive Hierarchical MoS2 Nanoflowers for In-Situ Soil Moisture Sensing(Elsevier, 01-12-2022) Kumar, Naveena; Borkar, Hitesh; Siroha, Piyush; Kumar, Rajesh; Patle, Kamlesh S; Dey, Kajal Kumar; Sing, Davender; Sharma, Yashpal; Ramovatar,; Gangwar, Jitendra; Agrawal, Yash; Palaparthy, Vinay; Agrawal, Yash; Agrawal, Yash; Palaparthy, Vinay; Palaparthy, Vinay; Patle, Kamlesh S (202121017)In this work, we explored hierarchical MoS2�nanomaterials�for soil moisture sensing (SMS) and tested their efficacy considering the operational aspects of the sensor. Carnation and marigold flower-like MoS2�nanostructures were prepared via facile hydrothermal processes with varying synthesis temperatures. The synthesized MoS2�nanostructures were well characterized by�XRD, FTIR, FESEM, EDS, and HRTEM and it is evident that the variation in the hydrothermal temperatures has a significant impact on the crystallinity, morphology, stoichiometry, dimensions, and lattice spacing. We found that hierarchical MoS2�marigold flower-like nanostructures offer the highest sensitivity of about 2000 %, when gravimetric water content (GWC) is varied from 1 % to 20 % GWC, which is one of the highest reported SMS. The sensors exhibit hysteresis of about ��4 % and response times of about 500�s. They were highly selective to moisture compared to the other salts like Na, K, Cd, and Cu present in the soil. The sensors were also unaffected by changing temperatures with a small 2�4 % between 20 �C and 65 �C.Publication Metadata only Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit(Taylor & Francis, 26-02-2023) Bhatti, Gulafsha; Pathade, Takshashila; Agrawal, Yash; Palaparthy, Vinay; Gohel, Bakul; Parekh, Rutu; Kumar, Mekala Girish; DA-IICT, Gandhinagar; Gulafsha Bhatti (202021005); Takshashila Pathade (201621013)At nanometer technology nodes, the efficient signal integrity and performance assessment of vast on-chip interconnects are crucial and challenging. For a long time, copper (Cu) has been used as an interconnect material in integrated circuits (ICs). However, as heading towards lower technology nodes, Cu is becoming inadequate to satisfy the requirements for high-speed applications due to its physical limitations. To mitigate this issue, a multiwall carbon nanotube bundle (MWCNTB) is proven to be a better replacement for Cu. Hence, the current work innovatively focuses on modeling, analysis, and performance evaluation of MWCNTB interconnects at 32?nm technology nodes using various machine learning (ML) and neural network (NN) based techniques for signal integrity assessment and fast computation of on-chip interconnect design. Based on the results obtained by comparing the different performance parameters, it is envisaged that NN-based ADAM technique leads to the best-suited model. The developed model is fruitful in evaluating the output performance of the system, such as power-delay-product (PDP), performing parametric analysis, and predicting optimum input design parameters of the driver-interconnect-load (DIL) system. This work utilizes HSPICE and Python electronic design automation tools for its implementation.