Publication: Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects
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Elsevier
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Takshashila Pathade, Agrawal, Yash, Parekh, Rutu, and Palaparthy, Vinay S, "Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects," Materials Today: Proceedings, Vol. 43, Part 6, 2021, ISSN: 2214-7853, 16 Feb. 2021, pp. 3874-3879.doi: 10.1016/j.matpr.2020.12.1182.