Journal Article
Permanent URI for this collectionhttps://ir.daiict.ac.in/handle/123456789/37
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Publication Metadata only Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization(IEEE, 11-02-2021) Pathade, Takshashila; Agrawal, Yash; Parekh, Rutu; Kumar, Mekala Girish; Agrawal, Yash; Parekh, Rutu; Agrawal, Yash; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Parekh, Rutu; Pathade, Takshashila (201621013)Publication Metadata only Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit(Taylor & Francis, 26-02-2023) Bhatti, Gulafsha; Pathade, Takshashila; Agrawal, Yash; Palaparthy, Vinay S; Gohel, Bakul; Parekh, Rutu; Kumar, Mekala Girish; Agrawal, Yash; Gohel, Bakul; Agrawal, Yash; Gohel, Bakul; Agrawal, Yash; Agrawal, Yash; Gohel, Bakul; Gohel, Bakul; Agrawal, Yash; Palaparthy, Vinay S; Gohel, Bakul; Parekh, Rutu; Gulafsha Bhatti (202021005); Takshashila Pathade (201621013)Publication Metadata only Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects(Elsevier, 16-02-2021) Pathade, Takshashila; Agrawal, Yash; Parekh, Rutu; Palaparthy, Vinay S; Agrawal, Yash; Parekh, Rutu; Agrawal, Yash; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Parekh, Rutu; Palaparthy, Vinay S; Pathade, Takshashila (201621013)Publication Metadata only Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnectsPathade, Takshashila; Agrawal, Yash; Parekh, Rutu; Palaparthy, Vinay S; Agrawal, Yash; Parekh, Rutu; Agrawal, Yash; Parekh, Rutu; Parekh, Rutu; Parekh, Rutu; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Parekh, Rutu; Palaparthy, Vinay S; Pathade, Takshashila