Publication:
Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects

Date

Authors

Journal Title

Journal ISSN

Volume Title

Publisher

Research Projects

Organizational Units

Journal Issue

Abstract

Description

Keywords

Citation

Takshashila Pathade, Agrawal, Yash, Parekh, Rutu, and Palaparthy, Vinay S, " Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects," Materials Today: Proceedings, Vol. 43, Part 6, 2021, ISSN: 2214-7853, 16 Feb. 2021, pp. 3874-3879.doi: 10.1016/j.matpr.2020.12.1182.

URI

https://ir.daiict.ac.in/handle/dau.ir/2027

Collections

Journal Article

Endorsement

Review

Supplemented By

Referenced By