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Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects

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dc.contributor.affiliationAgrawal, Yash
dc.contributor.affiliationParekh, Rutu
dc.contributor.affiliationPalaparthy, Vinay S
dc.contributor.authorPathade, Takshashila
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorPalaparthy, Vinay S
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorAgrawal, Yash
dc.contributor.researcherPathade, Takshashila
dc.date.accessioned2025-08-01T13:09:33Z
dc.format.extent3874-3879
dc.identifier.citationTakshashila Pathade, Agrawal, Yash, Parekh, Rutu, and Palaparthy, Vinay S, " Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects," Materials Today: Proceedings, Vol. 43, Part 6, 2021, ISSN: 2214-7853, 16 Feb. 2021, pp. 3874-3879.doi: 10.1016/j.matpr.2020.12.1182.
dc.identifier.doihttps://doi.org/10.1016/j.matpr.2020.12.1182
dc.identifier.issn2214-7853
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2027
dc.relation.ispartofseriesVol. 43; No. 6
dc.sourceMaterials Today: Proceedings
dc.source.urihttps://www.sciencedirect.com/science/article/abs/pii/S2214785320409009
dc.titleSignal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects
dspace.entity.typePublication
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