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Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects

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dc.contributor.affiliationAgrawal, Yash
dc.contributor.affiliationParekh, Rutu
dc.contributor.affiliationPalaparthy, Vinay S
dc.contributor.authorPathade, Takshashila
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorPalaparthy, Vinay S
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorAgrawal, Yash
dc.contributor.researcherPathade, Takshashila (201621013)
dc.date.accessioned2025-08-01T13:09:34Z
dc.date.issued16-02-2021
dc.format.extent3874-3879
dc.identifier.citationTakshashila Pathade, Agrawal, Yash, Parekh, Rutu, and Palaparthy, Vinay S, "Signal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects," Materials Today: Proceedings, Vol. 43, Part 6, 2021, ISSN: 2214-7853, 16 Feb. 2021, pp. 3874-3879.doi: 10.1016/j.matpr.2020.12.1182.
dc.identifier.doihttps://doi.org/10.1016/j.matpr.2020.12.1182
dc.identifier.issn2214-7853
dc.identifier.scopus2-s2.0-85105562793
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2040
dc.identifier.wosWOS:000645677500005
dc.publisherElsevier
dc.relation.ispartofseriesVol. 43; No. 6
dc.source Materials Today: Proceedings
dc.source.urihttps://linkinghub.elsevier.com/retrieve/pii/S2214785320409009
dc.titleSignal integrity analysis of bundled carbon nanotubes as futuristic on-chip interconnects
dspace.entity.typePublication
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