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Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization

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dc.contributor.affiliationAgrawal, Yash
dc.contributor.affiliationParekh, Rutu
dc.contributor.authorPathade, Takshashila
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorKumar, Mekala Girish
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorParekh, Rutu
dc.contributor.authorAgrawal, Yash
dc.contributor.authorAgrawal, Yash
dc.contributor.researcherPathade, Takshashila (201621013)
dc.date.accessioned2025-08-01T13:09:34Z
dc.date.issued11-02-2021
dc.format.extent194-204
dc.identifier.citationTakshashila Pathade, Agrawal, Yash, Parekh, Rutu, and Mekala Girish Kumar "Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization," IEEE Transactions on Nanotechnology, vol. 20, 11 Feb. 2021, pp. 194-204,doi: 10.1109/TNANO.2021.3058760.
dc.identifier.doihttps://doi.org/10.1109/TNANO.2021.3058760
dc.identifier.issn1941-0085
dc.identifier.scopus2-s2.0-85100832850
dc.identifier.urihttps://ir.daiict.ac.in/handle/dau.ir/2039
dc.identifier.wosWOS:000637178400001
dc.publisherIEEE
dc.relation.ispartofseriesVol. 20; No.
dc.source IEEE Transactions on Nanotechnology
dc.source.urihttps://ieeexplore.ieee.org/document/9353263
dc.titleStructure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization
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