Publications
Permanent URI for this collectionhttps://ir.daiict.ac.in/handle/123456789/32
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Publication Metadata only Reliability Assessment using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System(IEEE, 10-07-2025) Bhatti, Gulafsha; Sharma, Rohit; Kumar, Mekala Girish; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarPublication Metadata only Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs(IEEE, 04-03-2025) Kumar, Mekala Girish; Agrawal, Yash; Pulluri, Harish; Sharma, Rohit; DA-IICT, GandhinagarPublication Metadata only Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System(IEEE, 24-07-2025) Bhatti, Gulafsha; Kumar, Mekala Girish; Sharma, Rohit; Palaparthy, Vinay; Agrawal, Yash; DA-IICT, GandhinagarA printed circuit board (PCB) is one of the strong backbones to execute electronic system designs. Due to fast and reliable communication requirements between integrated circuit and other peripheral components over the PCB, there is a quest for the development of board-level designs and layouts. The advancement in technology has led to inventions from conventional rigid to flexible PCBs or flexible electronics (FE). The conformability of FE circuitry majorly depends upon the stretchable interconnects. An interconnect is the medium through which a signal is transmitted. The characteristic of stretchable interconnects is determined through their electrical and mechanical properties. The analytical model and parasitic extraction of the interconnect for rigid PCB structures have been widely explored earlier. However, the analytical formulation of the stretchable interconnect still remains a challenge and meagerly explored till date. Consequently, in this work, an explicit analytical model for the parasitic extraction of stretchable interconnects, viz., resistance (R), inductance (L), and capacitance (C), under stretching and bending effects has been novelly proposed. Five different interconnect materials have been considered for the analysis. The analytical model results have been validated with the ANSYS EDA tool. It is investigated that the proposed analytical model results are in very close agreement with the ANSYS results for all the considered cases.Publication Metadata only Neural Network-based Fast and Intelligent Signal Integrity Assessment Model for Emerging MWCNT Bundle On-Chip Interconnects in Integrated Circuit(Taylor & Francis, 26-02-2023) Bhatti, Gulafsha; Pathade, Takshashila; Agrawal, Yash; Palaparthy, Vinay; Gohel, Bakul; Parekh, Rutu; Kumar, Mekala Girish; DA-IICT, Gandhinagar; Gulafsha Bhatti (202021005); Takshashila Pathade (201621013)At nanometer technology nodes, the efficient signal integrity and performance assessment of vast on-chip interconnects are crucial and challenging. For a long time, copper (Cu) has been used as an interconnect material in integrated circuits (ICs). However, as heading towards lower technology nodes, Cu is becoming inadequate to satisfy the requirements for high-speed applications due to its physical limitations. To mitigate this issue, a multiwall carbon nanotube bundle (MWCNTB) is proven to be a better replacement for Cu. Hence, the current work innovatively focuses on modeling, analysis, and performance evaluation of MWCNTB interconnects at 32?nm technology nodes using various machine learning (ML) and neural network (NN) based techniques for signal integrity assessment and fast computation of on-chip interconnect design. Based on the results obtained by comparing the different performance parameters, it is envisaged that NN-based ADAM technique leads to the best-suited model. The developed model is fruitful in evaluating the output performance of the system, such as power-delay-product (PDP), performing parametric analysis, and predicting optimum input design parameters of the driver-interconnect-load (DIL) system. This work utilizes HSPICE and Python electronic design automation tools for its implementation.Publication Metadata only Structure Fortification of Mixed CNT Bundle Interconnects for Nano Integrated Circuits Using Constraint-Based Particle Swarm Optimization(IEEE, 11-02-2021) Pathade, Takshashila; Kumar, Mekala Girish; Parekh, Rutu; Agrawal, Yash; Parekh, Rutu; Agrawal, Yash; DA-IICT, Gandhinagar; Pathade, Takshashila (201621013)The emerging VLSI technology and simultaneously highly dense packaging of devices and interconnects in nano-scale chips have prosperously enabled realization of system-on-chip designs and advanced high-performance computing applications. Concurrently, these have aggravated inevitable challenges in miniaturized integrated circuits (ICs). One of the main limiters in the performance of high-speed VLSI designs is the on-chip interconnects. The emerging graphene based mixed carbon nanotube bundle (MCNTB) interconnects have been investigated as one of the most suited and physically realizable on-chip structure. The present work focuses on utilization of MCNTB as nano-interconnects in the optimized way. Determining optimized placement of CNTs in MCNTB configuration is tedious, skilful task and meagerly explored till date. This has been innovatively taken-up in the current work. In the present paper, novel and efficient particle swarm optimization (PSO) technique is explored and innovatively incorporated to obtain optimal distribution of CNTs in a given rectangular area. The objective function considered for the design is to maximize the tube density. Several signal integrity analyses have been executed. The proposed optimized mixed CNT bundle structure is compared with other different configurations of CNT bundle structures. It is analyzed that the proposed optimized MCNTB configuration produces highly favorable results and is apt suitable for futuristic nano IC designs. The different modelling and performance analyses are performed using MATLAB, SPICE and ADS EDA tools.Publication Metadata only An Efficient Crosstalk Model For Coupled Multiwalled Carbon Nanotube Interconnects(IEEE, 01-04-2018) Kumar, Mekala Girish; Chandel, Rajeevan; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarIn this paper, the crosstalk effects in coupled multiwalled carbon nanotube (MWCNT) interconnects have been analyzed. An unconditionally stable finite-difference time-domain (USFDTD) technique has been used for the crosstalk model. The in_phase delay, out_phase delay, and crosstalk noise for coupled interconnect lines have been determined. It is observed that crosstalk effect is less severe in MWCNT interconnects compared to the conventional copper interconnects. The results of the proposed model have been verified with the conventional FDTD technique, hailey simulation program with integrated circuit emphasis (HSPICE), and feature selective validation. For transient analysis, the proposed model on an average consumes 46% lesser CPU runtime as compared to the conventional FDTD technique. Further, stress and electro-migration effects have been analyzed for copper and MWCNT interconnects. The mean time to failure of MWCNT interconnects is found to be superior than that of copper interconnects.Publication Metadata only A prominent unified crosstalk model for linear and sub-threshold regions in mixed CNT bundle interconnects(Elsevier, 01-12-2021) Kumar, Mekala Girish; Agrawal, Yash; Vobulapuram Kumar, Ramesh; Chandel, Rajeevan; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarWith the feasibility to scale the devices and interconnects in highly sophisticated VLSI technology, the demand for high-speed and low-power�e-applications have also subsequently increased stupendously. Based on the applications and requirements, a VLSI system is operated in different modes as linear or sub-threshold. A unified analytical model for describing both these linear and sub-threshold modes is highly desirable. This has been innovatively presented in the current paper. Moreover, the futuristic and emerging mixed�carbon nanotube�bundle (MCB) as interconnects for both linear and sub-threshold region of operations has been considered. The essential signal integrity analysis comprising of several�crosstalk�effects such as associated�transient response, delay and power have been analyzed. To evaluate this, analytical model is formulated and proposed using accurate unconditionally-stable finite-difference time-domain (USFDTD) technique. Utilizing the proposed model, it is investigated that linear mode of operation is good for realizing high-speed systems while sub-threshold is a preferable operation for applications targeted for low-power. Comprehensively, it is envisaged that the average power-delay-product in MCB interconnects operating in sub-threshold region is low and reduced by 74% compared to corresponding linear region of operation. Also, it is demonstrated that the proposed unified USFDTD based model for MCB interconnects operating in different modes of operation is stable and not constricted by the Courant condition. At maximum allowable�time step, the proposed model is nearly 10 and 25 times faster than the conventional FDTD analytical and HSPICE simulation models, respectively. The results reveal that USFDTD technique provides better accuracy than the FDTD technique. The different performance analyses are performed at 22�nm technology node.Publication Metadata only A Unified Delay, Power and Crosstalk Model for Current Mode Signaling Multiwall Carbon Nanotube Interconnects(Springer, 01-04-2018) Agrawal, Yash; Kumar, Mekala Girish; Chandel, Rajeevan; DA-IICT, GandhinagarMultiwall carbon nanotube (MWCNT) has been investigated as a potential interconnect material for future advanced technology nodes. The present paper analyzes performance of MWCNT interconnects using current mode signaling (CMS) scheme. The novelty of the present work can be stated as: Firstly, a unified model is proposed for both copper and MWCNT interconnects using finite-difference time-domain (FDTD) technique. Secondly, this model is applicable for both the conventional voltage mode signaling and more versatile CMS schemes. Furthermore, the presented FDTD-based model is valid for single as well as�M-line coupled interconnects in integrated circuits. The model also incorporates CMOS gate as driver for MWCNT interconnect. Thirdly, power model using FDTD technique is investigated for the first time. Accurate formulation and computation of power dissipation in CMS MWCNT interconnects are presented in the paper. Propagation delay, power dissipation and power_delay_product (PDP) are the performance metrics considered for single-line CMS MWCNT interconnect. Crosstalk is analyzed for 2-Line and 5-Line coupled interconnects. It is investigated that CMS scheme leads to about 4 times lesser propagation delay and 2.5 times reduced PDP in MWCNT interconnect than the conventional copper interconnect for interconnect length of 4500�?m. The technology node considered is 32�nm. The response of the system is accurately computed using the proposed FDTD-based model. The maximum percentage error between results obtained by the proposed analytical model and SPICE simulation model is <3% for the various test cases.Publication Metadata only Carbon Nanotube Interconnects - A Promising Solution for VLSI Circuits(Taylor & Francis, 26-04-2016) Kumar, Mekala Girish; Agrawal, Yash; Chandel, Rajeevan; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; Agrawal, Yash; DA-IICT, GandhinagarIn nanoscale regime, the performance of traditional copper interconnects degrades substantially in terms of latency, power dissipation and induced crosstalk noise. This is due to miniaturization of electronic devices and many-fold enhancement of interconnect lengths in very large-scale integrated (VLSI) circuits. However, carbon nanotubes (CNTs) due to their unique physical properties such as high thermal conductivity, current carrying capability and mechanical strength have drawn the attention of researchers in recent times. The present paper provides comprehensive investigations in the various CNT structures for on-chip VLSI interconnect applications. Different configurations of CNT structures are studied namely single-wall CNT (SWCNT), multiwall CNT (MWCNT) and mixed-wall CNT bundle (MCB). The performance of CNT interconnects is analyzed using driver-interconnect-load system. It is investigated that the reduction in propagation delay in MCB interconnect is nearly 69%, 60%, 40% and 22% as compared to copper, SWCNT bundle, MWCNT and MWCNT bundle interconnect structures, respectively. This analysis considers an interconnect length variation from 500 to 2500 �m for 32-nm technology node. For the same dimensions the overall reduction in power dissipation in MCB interconnect is nearly 60%, 49%, 45% and 36% as compared to copper, SWCNT, MWCNT and MWCNT bundle interconnects, respectively. Furthermore, the effect of crosstalk on the interconnect structures has been examined. It is investigated that MCB has least crosstalk induced delay than all the other interconnect structures. Consequently, it is envisaged that MCB outperforms copper, SWCNT, MWCNT and MWCNT bundle interconnects and are best suited for future VLSI interconnects.